NanoLabTop-tier technology made available to the UCLA community and beyond. Deposition Back to equipment list >> Deposition Oxidation – Tystar – Tube 1Deposition, Engineering Site Deposition Oxidation – Tystar Tytan 3600 – Tube 2CNSI Site, Deposition Deposition LPCVD Nitride Low Stress – Tystar -Tube 2Deposition, Engineering Site CHA Solution E-Beam EvaporatorCNSI Site, Deposition Deposition PECVD – BMR TechnologyDeposition, Engineering Site CHA Mark 40 Evaporator (old)Deposition, Engineering Site CHA Mark 40 Evaporator (new)Deposition, Engineering Site Deposition – CVC 601 SputtererDeposition, Engineering Site Denton Desk II Deposition SputterDeposition, Engineering Site Denton Desk V Thin Film Deposition SystemCNSI Site, Deposition Denton Discovery SputtererDeposition, Engineering Site Ultratech Fiji – Atomic Layer DepositionDeposition, Engineering Site Deposition LPCVD Tystar Titan II – Tube 4Deposition, Engineering Site Deposition LPCVD Nitride/Poly/LTODeposition, Engineering Site Deposition LPCVD Polysilicon – Tystar Tube 3Deposition, Engineering Site Deposition LPCVD Nitride – Tystar Tube 2Deposition, Engineering Site Deposition PECVD – Plasma Therm 790Deposition, Engineering Site Polifab STS Multiplex CVD Deposition SystemDeposition, Engineering Site Ultratech Savannah Atomic Layer DepositionDeposition, Engineering Site SCS PDS 2010 Parylene DepositionCNSI Site, Deposition, Engineering Site Sloan E-Beam EvaporatorDeposition, Engineering Site Deposition Oxidation – Tystar Tytan 3600 – Tube 1CNSI Site, Deposition Ulvac JSP 8000 Metal Deposition SputterCNSI Site, Deposition
