Wafer Surface Analysis Systems are specially designed for use in semiconductor wafer processing quality control. The system provides quick and accurate contact angle/surface energy analysis on wafer surface to evaluate adhesion, cleanliness and coatings. The syringe mechanism can be raised for easy loading and unloading eliminating the possibility of wafer damage.

Although the system was designed for wafer surface analysis it is also a useful tool for any application that requires a large stage. Samples sizes up to W12” x L12” x H.75” can easily be accommodated by this system.

Applications:

•  Coating assessment of the HMDS process.
• Surface contamination detection.
• Coating uniformity.
• Coating quality.
• Surface cleanliness.