Equipment Category – Deposition
Deposition PECVD – BMR Technology
Location: Engineering IV Site | Back to Equipment >>
Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
BMR’s HiDep™ generates highly dissociated plasmas by using time-varying magnetic fields excited by a specially designed antenna array at radio frequency (RF). This proprietary antenna array provides the HiDep™ plasma with high power efficiency over a wide range of operating pressure and power settings. A special magnetic field is localized at the chamber circumference to further enhance electron confinement and hence deposition properties.