NanoLab Equipment
UCLA Nanolab
Equipment- Metrology
Tencor Flexus Stress Tester
Location: Engineering Cleanroom | Back to Equipment >>
The Flexus us a stress measurement instrument that measures the change in the radius of curvature of a wafer caused by the deposition of a thin film.
Features
- Flexible and intuitive software
- All the input are editable and all the output files can be used easily by external tools.
- Wafer Size: 2″ to 8″

Additional Information
- Hyunh Do
- do.huynh@gmail.com
- 310.206.4641
- Joe Zendejas
- zendejas@ucla.edu
- 310.206.5528
- Trainings Required: 1