NanoLab Equipment

UCLA Nanolab

Equipment- Metrology

Tencor Flexus Stress Tester

Location: Engineering Cleanroom | Back to Equipment >>

The Flexus us a stress measurement instrument that measures the change in the radius of curvature of a wafer caused by the deposition of a thin film.

Features

  • Flexible and intuitive software
  • All the input are editable and all the output files can be used easily by external tools.
  • Wafer Size: 2″ to 8″

 

 

Additional Information