Equipment Category – Etching
Oxford Plasmalab 80 Plus RIE
The NanoLab has two Oxford 80 Plus Fluorine reactive-ion etching systems, one in the Engineering IV site and the other in the CNSI site. Please use the LabRunr links above to reserve each respective piece of equipment.
The Plasmalab 80 reactive ion etch (RIE) is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high performance processes using optimised electrode cooling and excellent substrate temperature control.
- Open load design allows fast wafer loading and unloading
- Excellent etch control and rate determination
- Excellent wafer temperature uniformity
- Up to 200mm wafers
- Low cost of ownership
- Built to Semi S2/S8 standards