Plasmatherm SLR-770 ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2” to 8” depending on which process kit is installed. Currently configured with 3” kit. Thermal transfer module for effective cooling of substrate utilizing helium backside thermal transfer in conjunction with computer controlled substrate clamping. High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Previous gases used N2, O2, CHF3, AR, CH4, CL2, BCL3, CF4. Includes water chiller.