TThe TeGal PlasmaLine asher is a general purpose O2 plasma used to remove photoresist and for general purpose cleaning. It incorporates RF as the plasma source and is typically used at 300-400 mT. It has a high selectivity to resist and an overall low removal rate. It is typically used for descrum processes. 

Specs

• Wafer Size: 200 mm maximum. Wafers smaller than 200 mm and irregularly shaped samples must be placed on carriers.
• Power Range: < 200 W
• Pressure Range: < 500 mTorr