The Ulvac JSP 8000 is a reactive sputter deposition system. The tool is capable of sputter depositing thin metal and dielectric films on silicon, gallium arsenide and other substrates.

The Ulvac JSP 8000 Sputter Deposition System is configured for thin film deposition of up to 4 materials sequentially or simultaneously without breaking vacuum. The system is equipped with two 4-inch DC and two 4-inch RF target positions. The machine can run reactive deposition using a high temperature heater in a plasma environment. The tool can also deposit metals from multiple targets at the same time.