Equipment Category – Deposition
Ulvac JSP 8000 Metal Deposition Sputter
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The Ulvac JSP 8000 Sputter Deposition System is configured for thin film deposition of up to 4 materials sequentially or simultaneously without breaking vacuum. The system is equipped with two 4-inch DC and two 4-inch RF target positions. The machine can run reactive deposition using a high temperature heater in a plasma environment. The tool can also deposit metals from multiple targets at the same time.